Creating Excellence in Electronics Assembly

The IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies has emerged as the preeminent authority for electronics assembly manufacturing. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products.

IPC received hundreds of requests from companies worldwide to support this critical standard with a formal training program that recognizes individuals as qualified instructors and provides them with teaching materials. Now, IPC has an industry developed and approved comprehensive, hands-on solder training and certification program based on J-STD-001 that gives companies all the tools they need to increase employee skills and performance.

This solder training program concentrates on the process requirements for soldering.

Module One – General Requirements
This module is an introduction and overview to the entire contents of J-STD-001 Rev. E. and is a prerequisite to any of the following four technical specific modules. Module 1 consists of lecture, review, and an open and closed book written exam.

Module Two – Wires and Terminals
This module provides requirements for wire and terminal applications consisting of lecture, review, and instructor demonstrations. The students will prepare and solder wires to turret, bifurcated, J-hook, pierced, and cup terminals. Students must demonstrate proficiency in preparing and soldering wires to the above terminal types and pass the open book exam.

Module Three – Pin-Through-Hole Technology
This module provides requirements for though-hole technology consisting of lecture, review, and instructor demonstrations. Students must prepare and solder through hole components to a printed circuit board. Components include a variety of axial and radial leaded devices. Students must also remove components from a PCB in a non-destructive manner. Students must demonstrate proficiency in the above and also pass the end open book exam.

Module Four – Surface Mount Technology
This module provides requirements for surface mount technology consisting of lecture, review, and instructor demonstrations. Components types include 1206 through 0402 chips, SOIC’s, PLCC’s, SOT’s, QFP’s, TSOP’s, etc. The students must demonstrate proficiency in various types of installations (convective and conductive) and removals and pass an open book examination.

Module Five – Inspection Methodology
This module provides requirements for inspection methodology and a basic introduction to process control issues. Through lecture and actual inspections of a sample PCB the student will demonstrate their proficiency in identifying acceptable and defective conditions according to the Standard. An open book examination is also required.

J-STD-001DS space addendum includes additional requirements over those published in J-STD-001D. The space community felt the base document does not adequately cover requirements that will help hardware survive the rigorous thermal cycles and intense vibration the hardware will be exposed to during acceptance and/or qualification testing, as well as during launch and mission life. There are also materials issues for hardware that will be in a micro-atmosphere (vacuum) environment. Although these are largely the responsibility of the design activity, some requirements in J-STD-001DS space addendum are intended to provide default materials requirements, or to at least initiate a discussion between manufacturing and the design activity.

All written exam grades for Modules completed will be averaged together. The minimum score for successful completion is 70%. The minimum score for each lab session is also 70%.

Upon successful completion of the course students will receive an IPC J-STD-001 Certified IPC Specialist certification good for two years.


IPC's J-STD-001 Training and Certification Program provides individuals with a valuable, portable credential that recognizes their understanding of the J-STD-001. This program is offered as a service to industry, therefore its adoption is not a precondition for any company to purchase the standard or claim that they build product to its requirements.

Program Benefits

Those interested in company-wide quality assurance initiatives have an IPC-sponsored program to support their commitment to continuous operations and product improvement. IPC recognition sends a strong message to customers that your company is serious about implementing J-STD-001.

JSTD Document overview.

IPC/EIA/JEDEC J-STD-001 Ansi approved lead free acceptance criteria. World recognized as the sole industry consensus standard covering soldering materials and processes, includes criteria for lead free manufacturing, materials, methods and verification for producing quality soldered interconnections and assemblies.

IPC "Certified IPC Specialist" 7.0 J-STD-001D with DS Requirements for Space Hardware Addendum This addendum is of specific interest to support the manufacturers whose products must survive the vibration and cyclic temperatures of going to or operating in space. Upon successful completion of this learning activity, students will be certified to the DS Module 6 of the IPC J-STD-001DS Space Hardware Addendum. Participants will obtain the knowledge to Interpret the differences between the requirements of class 3 and the supplemental requirements for products going to or operating in space and Reference the J-STD-001D and Space Hardware standards to make accept/reject decisions. This addendum can be taught with the original certification or as a separate class for existing CIS students. Please note space addendum ONLY available for revision D of the JSTD-001 at this time.

IPC/EIA/JEDEC J-STD-002 Solderability tests for component leads terminations, lugs, terminals and wires. Test method choices, defect definitions, acceptance criteria and illustrations for both the supplier and user

IPC/EIA J-STD-003 Solderability for printed boards Industry recommended test methods, defect definitions and illustrations for suppliers and users to assess the solderability of printed board surface conductors, lands and plated-through holes. Test methods covered include edge dip, rotary dip, solder float, wave solder, and wetting balance

IPC J-STD-004 Requirements for Soldering Fluxes. Covers requirements for qualification and classification of rosin, organic, and inorganic fluxes according to activity level and halide content of the fluxes. Includes flux containing materials and low residue fluxes for no clean processes.

IPC/EIA J-STD-005 Requirements for Soldering Pastes Covers requirements for qualification and characterization of solder paste. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder paste.

IPC J-STD-006 Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications. Prescribes the nomenclature, requirements and test methods for electronic grade solder alloys, fluxed and non-fluxed bar, ribbon, and powder solder; electronic soldering applications and “ special ” electronic grade solders. This is a quality control standard and is not intended to relate directly to the materials performance in the manufacturing process.


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